Our Services

Our integrated team of designers, machinists,
and R&D engineers will lead you through product
conceptualization and prototyping to assembly.

  • MEDICAL DEVICE ASSEMBLY

    Class 100 Clean Room for medical device assembly.

  • MILITARY & AEROPACE ELECTRONICS

    Design and build high-frequency power amplifiers in custom ceramic packaging.

  • FAILURE ANALYSIS LAB

    Inhouse FA Lab including X-ray, Wire Bond Pull Test, Die Sheer Test, C-SAM, CEM, and optical inspection.

  • CERAMIC SUBSTRATES

    Custom fast-turn, multi-layer ceramic substrates using LTCC ceramic technology.

  • EUTECTIC DIE ATTACH

    Design and manufacture graphite tooling inhouse to shorten delivery times.

  • WAFER PROCESSING

    Our experienced lab technicians conduct wafer sawing, wafer wash, and pick and place.

  • WIRE BONDING

    • Gold Wire Bonding

    • Aluminum Wire Bonding

    • Wedge to Wedge Bonding

    • Automatic Bonding

    • RF Ribbon Bonding

  • CUSTOM GRAPHITE TOOLING

    Inhouse designers and machinists fabricate custom graphite tooling and fixturing.

  • INHOUSE MACHINE SHOP

    Inhouse machinists facilitate quick turn, custom tooling and semiconductor test fixtures.